马来酸对次磷酸钠化学镀铜沉积行为的影响  

Influence of Maleic Acid on the Deposition Behavior of Sodium Hypophosphite Electroless Copper Plating

作　　者：赵金花[1] 李志新 王劭南[1] 殷列[1] 

机构地区：[1]陕西师范大学化学与材料科学学院,陕西西安710062

出　　处：《电镀与环保》2009年第2期35-38,共4页Electroplating & Pollution Control

摘　　要：研究了以次磷酸钠为还原剂,柠檬酸钠为配位剂的化学镀铜体系中,添加剂马来酸对镀层成分、结构、形貌以及对次磷酸钠阳极氧化和铜离子阴极还原的影响。结果表明:加入马来酸后体系仍能保持较高镀速,而镀层颗粒大小逐渐变得均匀,外观颜色也由暗棕色逐渐变为铜色。化学镀铜层为面心立方结构,没有出现Cu-Ni合金晶面衍射峰。The influence of additive maleic acid on the deposit composition, structure and morphology as well as the anodic oxidation of hypophophite and the cathodic reduction of cupric ions is investigated in the system of electroless copper plating using sodium hypophosphite as a reducing agent and sodium citrate as a complexant. The results show that when maleic acid is added, higher deposition rate can be maintained, however the deposit particles gradually become uniform and the color also gradually turns to copper red from dark brown. The deposit is of a face-centered cubic structure and Cu-Ni alloy diffraction peak is not found in the deposit.

关 键 词：化学镀铜 次磷酸钠 马来酸 

分 类 号：TQ153[化学工程—电化学工业]