超光滑表面加工方法的新进展  

A new development of ultra-smooth surface machining technology

作　　者：张巨帆[1] 王波[1] 董申[1] 

机构地区：[1]哈尔滨工业大学精密工程研究所,哈尔滨150001

出　　处：《光学技术》2007年第S1期150-154,共5页Optical Technique

基　　金：国家自然科学基金重点项目(50535020);国家自然科学基金(50775055);武器装备预研基金(9140A180202-60HT0132);黑龙江省自然科学基金(E200622)

摘　　要：通过回顾超光滑表面加工技术的发展历程,对多种具有代表性的超光滑表面加工方法的原理和应用作了简单阐述,并重点提出和介绍了一种大气等离子体抛光方法。该方法实现了利用常压等离子体激发化学反应来完成超光滑表面的无损伤抛光加工,并首次引入电容耦合式炬型等离子体源,为高质量光学表面的加工提供了一条新的途径。试验结果表明,在针对单晶硅的加工过程中实现了1μm/min的加工速率和Ra 0.6nm的表面粗糙度。The overview is presented for the progress of ultra-smooth surface machining technologies,and some typical methods and principles are introduced.Moreover,an atmospheric pressure plasma polishing(APPP) method is developed.APPP utilizes a capacitance coupling atmospheric pressure radio-frequency plasma torch to generate plasma and reactive radicals.It accomplishes the atom scale removal process by chemical reactions with no surface/subsurface defects introduced. The experiment results indicate that,in initial operations applied on silicon wafers,the 1μm / min removal rate in depth and Ra 0.6 nm surface roughness have been achieved.

关 键 词：超光滑表面 超精密加工 大气等离子体 电容耦合 

分 类 号：TG664[金属学及工艺—金属切削加工及机床]