红外焦平面可靠性封装技术  

STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR

作　　者：龚海梅[1] 张亚妮[1] 朱三根[1] 王小坤[1] 刘大福[1] 董德平[1] 游达[1] 李向阳[1] 王平[1] 朱龙源[1] 方家熊[1] 

机构地区：[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083

出　　处：《红外与毫米波学报》2009年第2期85-89,共5页Journal of Infrared and Millimeter Waves

基　　金：国家自然科学基金重点(50632060);中国科学院创新基金(CXJJ-239)资助项目

摘　　要：系统研究了红外焦平面组装、封装及其可靠性技术,解决了组件结构模拟、子模块精确定位、扁平引线设计、低漏率激光焊接、杜瓦内表面气体解吸分析及其解决途径等理论与技术问题,进行了组件可靠性、器件的高能粒子辐照与激光辐照等试验,获得了一批实用化焦平面组件杜瓦和扁平引线,并均已转入工程研制.研究结果表明微型杜瓦的热负载小于250mW,真空保持寿命大于1年半.Techniques of assembly, packaging and reliability of infrared focal plane array （IRFPA） were systematically studied. Some theoretic and technical problems were solved, such as the simulation of assembly conformation, high precision allocation of the modules, the design of flat leading wire, low leakage rate of laser welding, the way to decrease outgassing of Dewar inner surface. For the IRFPA detector the tests of assembly reliability, high-energy particle and laser irradiations were carried out. A batch of practical infrared focal plane Dewar assembly and flat leading wire were obtained. These techniques have been implemented in project. The experimental results show that the thermal load of micro-Dewar is less than 250mW and the vacuum life of Dewar is more than 18 months.

关 键 词：红外焦平面 封装 可靠性 

分 类 号：TN737.745[电子电信—电路与系统]