喷镀系统在凸点制备中的应用  

Application of Fountain Plating to Solder Bump Manufacture

作　　者：段晋胜[1] 轧刚[1] 

机构地区：[1]太原理工大学,山西太原030024

出　　处：《电子工艺技术》2009年第3期166-168,共3页Electronics Process Technology

基　　金：国际科技合作项目(项目编号:2008DFA10530)

摘　　要：介绍了利用电镀法制造晶圆凸点的典型工艺和喷镀设备。喷镀系统是凸点电镀设备中最关健的部件。通过计算机软件模拟试验,对喷镀系统中的喷杯体和匀流板等各种参数和位置进行了优化设计,并在设备上应用验证。该系统在凸点电镀设备上应用后,在晶圆片上成功做出了高质量的均匀凸点,取得了良好效果。Introduce the typical process and fountain plating system of solder bump manufacture for wafer level package. Fountain plating system is a key part of solder bump plating machine. The optimum designs of varions parameters for fountain plating cup body, diffuser and location in fountain plating system are made by computer software simulating test, and are proved by the practical application. The and consistent solder bump for wafer level package are made with the fountain plating system. quality

关 键 词：晶圆级封装 凸点制备 喷镀 匀流板 

分 类 号：TN405[电子电信—微电子学与固体电子学]