我国集成电路测试技术现状及发展策略  

Current status on chinese integrated circuit testing technology and its development strategies

作　　者：俞建峰[1] 陈翔 杨雪瑛 

机构地区：[1]江苏出入境检验检疫局机电产品检测中心,江苏无锡214101 [2]无锡质量技术服务公司技术部,江苏无锡214101

出　　处：《中国测试》2009年第3期1-5,共5页China Measurement & Test

基　　金：国家质量监督检验检疫总局科技项目(2008IK078)

摘　　要：集成电路在现代电子整机中的应用比重已超过25%,测试是分析集成电路缺陷的最好工具,通过测试可以提高集成电路的成品率。通过分析我国集成电路产业现状,论述我国集成电路的设计验证测试、晶圆测试、芯片测试、封装测试等关键测试环节的技术水平,提出进一步发展我国集成电路测试产业的相关建议。At present, integrated circuits have occupied 25% of the whole electrical and electric equipments. And testing technologies are the best tools for analyzing the defections of the integrated circuits. In this article, the current status on Chinese integrated circuit industry was analyzed. And the key testing technologies including the design verification, wafer testing, chip testing, package testing were also presented. At last, strategies for developing testing technologies for Chinese integrated circuits were proposed.

关 键 词：集成电路 设计验证 晶圆测试 芯片测试 封装测试 发展策略 

分 类 号：TN47[电子电信—微电子学与固体电子学] TN407