UV-LIGA技术制备大厚度高开孔率精细金属网板  

Fabrication of Thick Metal Micromesh Sieves with High Open Area Using the UV-LIGA Process

作　　者：周峰[1] 朱荻[1] 明平美[1] 胡洋洋[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点实验室,江苏南京210016

出　　处：《精细化工》2009年第6期589-594,共6页Fine Chemicals

基　　金：国家自然科学基金重点项目(50635040);中国博士后科学基金项目(20070421008)~~

摘　　要：分析了现有的精细金属网板制造工艺的优缺点,提出了采用基于SU-8光刻胶的UV-LIGA技术来制备大厚度高开孔率精细金属网板的工艺方法。实验优选了前烘、曝光、后烘、显影、微细电铸、去胶等关键操作环节的工艺参数,检测并分析了试样性能。结果表明,综合采用涂胶后静置;前烘65℃,20 min,95℃,20 min;曝光剂量260 mJ/cm2;后烘65℃,10 min,95℃,15 min;随炉冷却;超声辅助显影(超声功率25 W,频率33 kHz,时间5min);交变低压-温度梯度微细电铸等工艺条件,可制备出厚度(120±3)μm、开孔率88%的六边形网孔(边长200μm)精细镍板,网板孔形一致性好,孔壁平滑。In this paper, the advantage and disadvantage of the existing fabrication process for the metal micromesh sieves were discussed. An optimized UV-LIGA technique, based on SU - 8 photoresist process,was successfully applied to manufacture the thick nickel hexagonal micromesh sieve -sheets with high open area. The key process points of fabrication method were optimized and the performance of sieve sample was examined and analyzed. The experimental results show that, using the optimized experimental process parameters of some key fabrication steps（ before-exposure bake ：65℃ ,20 min ,95℃,20 rain; exposure energy： 260 mJ/cm=; post-exposure bake： 65℃, 10 min,95 ℃, 15 min;accessorial measurements：ultrasonic developing, placing in air, cooling with stove closed;assisting low air-pressure alternately and temperature-gradient micro electroforming technique）, a nickel hexagonal micromesh sieve with high open area is fabricated. Then main body of the nickel Micromesh Sieve has high open area of 88%, thickness of （ 120 ±3 ） μm, appropriate dimensional accuracy, good appearance quality.

关 键 词：精细筛网 高开孔率 UV—LIGA 微细电铸 

分 类 号：TN305.7[电子电信—物理电子学]