内嵌金属导热通道环氧模塑料导热性能与模拟  

Thermal Conductive Performance and Thermal Simulation of High Thermal Conductive Epoxy Molding Compound

作　　者：石志想[1] 傅仁利[1] 曾俊[1] 张绍东[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《电子与封装》2009年第7期17-21,共5页Electronics & Packaging

基　　金：国家自然科学基金资助项目(批准号:50472019)

摘　　要：设计了垂直与水平两种导热结构,用高导热金属铜为填料在环氧模塑料(EMC)中进行填充,通过热模压法制备了样品。采用双热流计稳态法对样品导热系数进行了测试,采用ANSYS软件对EMC的热传导规律进行了模拟,并与实验结果进行比较分析。研究发现,随着铜填充量的增加,EMC的导热系数随之提高,填充量仅为25vol%时垂直导热结构试样导热系数高达104.62W/m·K。相同填充量下,垂直导热结构样品的导热系数远高于水平导热结构样品,垂直导热结构样品随着铜填充量的增加导热系数增加速度也明显快于水平导热结构样品,并出现明显的渗逾效应。模拟结果与实验结果符合较好。Two thermal conductive structures, vertical one and horizontal one were designed and high thermal conductive copper were filled into Epoxy Molding Compound （EMC）, the specimen was prepared using a hot press method. Thermal conductivity of the specimen was tested through a steady-state bi-substrate technique, ANSYS software was applied to simulate thermal conductive rules of the EMC, and the numerically calculated results were compared with the experimental ones. It was found that thermal conductivity of EMC increase with the increase of volume fraction of copper filler. At certain filler content, specimen with vertical structure has higher thermal conductivity than those with horizontal structure, at the same time, thermal conductivity of specimen with vertical structure increase faster than specimen with horizontal structure, a percolation effect was also seen in specimen with vertical structure. The simulation results fit well with experimental results.

关 键 词：环氧模塑料 导热结构 导热系数 ANSYS 导热模拟 

分 类 号：TM21[一般工业技术—材料科学与工程]