无铅化微电子互连技术与导电胶  

Lead-free interlinkage technique and electrically conductive adhesive in encapsulation of micro-electronics

作　　者：张绍东[1] 傅仁利[1] 曾俊[1] 石志想[1] 宋秀峰[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016

出　　处：《中国胶粘剂》2009年第7期34-40,共7页China Adhesives

基　　金：国家自然科学基金(50872054)

摘　　要：介绍了电子互连用导电胶(ECA)的组成和基本性能,综述了ECA在电学性能、力学性能和稳定性等方面的研究进展。随着世界范围内含铅材料的限制和禁止使用,电子制造过程中的无铅化已成为该领域的发展方向和必须面对的挑战。ECA是替代含铅钎料、实现微电子互连技术无铅化的重要发展方向。虽然目前ECA仍存在着电阻率偏高、易老化失效和电流通过能力偏低等问题,但是高性能树脂和新型导电填料的不断涌现,将为ECA性能的提高提供新的解决途径和方法。The composition and basic performance of electrically conductive adhesive（ECA） for interlinkage of micro-electronics were introduced, the research progress of electrical performance, mechanics performance and stability for ECA were summarized. The lead-free was already an inevitable development direction and challenges in electronic manufacturing process because the materials with lead were restricted and prohibited in worldwide. ECA as substitute of lead solder is an important development way in lead-free interlinkage technique of micro-electronics. Although ECA had still some shortage such as higher resistivity,easy aging failure and limited current-carrying capability,but a lot of new solution and methods for improving performance of ECA were afforded with teemed high-performance resins and new type conductive fillers.

关 键 词：导电胶 微电子 互连技术 无铅化 

分 类 号：TQ437.6[化学工程]