微电子器件封装中铜与金球键合的比较(英文)  

Comparison of Cu and Au Ballbonding in Microelectronics Packaging

作　　者：Christopher Breach 

机构地区：[1]Wire Bond Strategic Business Unit Oerlikon Assembly Equipment Pte Ltd

出　　处：《电子工业专用设备》2009年第7期25-28,共4页Equipment for Electronic Products Manufacturing

摘　　要：铜球键合由于其成本低并且还可提供更高的可靠性潜力, 最终将成为一种更加流行的主要工艺。目前现有的少管脚数的封装已有一种从金丝向铜丝转变的倾向,但是其中有一些工艺问题,需要该工艺在先进封装中得到广泛的应用之前得以根本的解决。无论采用何种方法,人们可以期望在先进封装中降低成本将最终成为采用铜球键合的驱动力。Thermosonic ball bonding is a major interconnect process in microelectronics packaging and is posi- tioned to remain one of the key process technologies available to package designers in the foreseeable fu- ture. However, the main wire material used in fine pitch （FP） and ultra - fine pitch （UFP） ballbonding is gold and with drastic increases in gold price, gold ball- bonding has become a more costly process that has a considerable economic effect on the assembly of pack- ages used in consumer electronics. An alternative wire material to gold is copper,

关 键 词：先进封装 铜球键合 封装成本 键合可靠性 电学性能 热学性能 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]