键合金丝的研究进展及应用  

Development and Application of Gold Bonding Wires

作　　者：郭迎春[1] 杨国祥[1] 孔建稳[1] 刀萍[1] 管伟明[1] 

机构地区：[1]昆明贵金属研究所,贵研铂业股份有限公司,云南昆明650106

出　　处：《贵金属》2009年第3期68-71,78,共5页Precious Metals

基　　金：国家科技支撑计划项目(2007BAE26B00)

摘　　要：介绍了键合金丝的特性、种类及其适用的封装领域;微合金化高纯金丝、合金型金丝、复合型金丝和键合铜丝的研究发展概况,以及各类型键合丝在市场上所处的地位;键合金丝主要应用领域—集成电路(IC)和半导体分立器件的发展情况。分析了国内外键合金丝市场、产业状况以及该行业的发展趋势。Many aspects were introduced on characteristics, types and applied package fields of gold bonding wires as well as the bonding wire market. The developments of the bonding wires are involved with alloying high -purity gold wire, alloy type gold wire , composite gold wire and Cu bonding wire. The main application fields--IC and semiconductor discrete devices were recounted too. The domestic and international market and industries of gold bonding wire were analyzed. At last the developing trend of gold bonding wire was declared.

关 键 词：金属材料 半导体封装 键合金丝 分立器件 集成电路 

分 类 号：TG146.31[一般工业技术—材料科学与工程]