MEMS中Ni-W合金薄膜力学性能的研究  

Study on mechanical properties of Ni-W alloy films in micro-electro-mechanical system

作　　者：刘瑞[1] 汪红[1] 汤俊[1] 毛胜平[1] 陈辉[1] 丁桂甫[1] 

机构地区：[1]上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200240

出　　处：《传感器与微系统》2009年第8期46-48,共3页Transducer and Microsystem Technologies

基　　金：国家"863"计划资助项目(2006AA4Z326)

摘　　要：研究了柠檬酸胺—1—羟基乙烷二膦酸(HEDP)镀液体系中Ni-W的力学性能。通过紫外曝光的光刻、电铸和注塑(UV-LIGA)技术制备出微拉伸试样和单轴微拉伸测试系统进行拉伸试验。结果表明:在Ni-W薄膜试样尺寸为5μm×50μm×100μm条件下,其杨氏模量约为100.4 GPa,抗拉强度为1.96 GPa,应变约为3.6%。The mechanical properties of Ni-W alloy films electrodeposited in the system of citrate amine-HEDP are sdudied. The testing chip is fabricated with UV-LIGA technology and measured by uniaxial micro-tensile system. The gauge section of Ni-W thin film specimen is 5 μm × 50 μm × 100 μm. The results show that the Young＇ s modulus of Ni-W film is about 100.4 GPa, tensile strength is about 1.96 GPa and strain is about 3.6 %, respectively.

关 键 词：微机电系统 Ni—W合金 电沉积 力学性能 拉伸试验 

分 类 号：TG115[金属学及工艺—物理冶金]