双马来酰亚胺树脂体系在封装基板上的应用  

Application of Modified Bismaleimide Resin in Integrated Circuits Package Substrate

作　　者：王敬锋[1] 苏民社[1] 孔凡旺[1] 杨中强[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《绝缘材料》2009年第4期44-48,52,共6页Insulating Materials

基　　金：国家科技部支撑计划项目(2007BAE46B01);粤港关键领域重点突破项目(2008A011800001)

摘　　要：介绍了半导体IC封装技术和封装基板的技术发展需求,阐述了双马来酰亚胺树脂的改性方法及其在封装基板上的应用,分析了三菱瓦斯化学公司的双马来酰亚胺-三嗪树脂(BT树脂)材料封装基板的特性,结果表明,该树脂可满足封装领域的技术要求,应用前景广阔。The development and requirements for the IC package and substrate technology were summarized.The modification methods of bismaleimide resin and its applications in IC package substrate were reviewed;especially the characteristics of bismaleimide-triazine resin-based laminates for the IC substrate made by Mutsubishi Gas Chemical Co.were analyzed.The BT resin has long been applied to IC substrate applications,which means a promising application prospect.

关 键 词：IC封装 覆铜板 双马来酰亚胺-三嗪树脂(BT树脂) 

分 类 号：TM215.1[一般工业技术—材料科学与工程] TN409[电气工程—电工理论与新技术]