SPS方法制备铜/金刚石复合材料  

Preparation of Cu/diamond composites by spark plasma sintering

作　　者：张毓隽[1] 童震松[1] 沈卓身[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《北京科技大学学报》2009年第8期1019-1023,共5页Journal of University of Science and Technology Beijing

摘　　要：采用放电等离子烧结(SPS)方法制备出高体积分数的铜/金刚石复合材料,并对复合材料的致密度、热导率和热膨胀系数等进行了研究.结果表明,采用该方法制备的铜/金刚石复合材料微观组织均匀,致密度分布为94%～99%,最高热导率为305W.(m.K)-1,热膨胀系数与常见电子半导体材料相匹配,能够满足电子封装材料的要求.High volume fraction Cu/diamond composites were successfully prepared by spark plasma sintering （SPS）. Their relative density, thermal conductivity and coefficient of thermal expansion （CTE） were investigated. It is found that the composites have a uniform microstructure, with the relative density from 94 % to 99%, the highest thermal conductivity of 305 W· （m·K）^-1, and the CTE matching with common electronic semiconductor materials. All these properties can meet the demands of electronic packaging materials.

关 键 词：复合材料 热导率 热膨胀系数 电子封装 放电等离子烧结 

分 类 号：TB333[一般工业技术—材料科学与工程]