氮化铝与可伐封接件有限元应力分析  

Finite Element Stress Analysis on Nitride Aluminum Ceramics to Kovar Metal Sealing Parts

作　　者：李新宇[1] 高陇桥[1] 鲁燕萍[1] 刘征[1] 

机构地区：[1]北京真空电子技术研究所,北京100016

出　　处：《真空电子技术》2009年第4期75-77,共3页Vacuum Electronics

摘　　要：陶瓷金属封接件内残余应力主要是由热膨胀系数不匹配造成的,受各种因素的影响.其应力大小、分布影响着封接件的可靠性。对微波管内复杂氮化铝陶瓷-可伐金属结构运用有限元法计算封接件的应力。计算的结果表明,实际断裂方式与有限元分析相吻合。在此基础上,优化了封接结构,提出改进工艺,取得成功。The residual stress of ceramic to metal sealing parts mainly caused by mismatch of the thermal expansion coefficient, which affected by various factor. The distribution and magnitude of stress affects the reliability of the sealing parts. The stress of complex AlN ceramics and Kovar metal sealing parts which used in the high power microwave tube was calculated by the finite element method. The calculation results suggested that the real fracture pattern was consistent with the analysis of the finite element method. We successfully optimized the sealing structure, improved sealing process on the basis of FEM results.

关 键 词：封接应力 有限元法 陶瓷-金属封接 

分 类 号：TB756[一般工业技术—真空技术]