缓冲剂对镀镍过程作用机理的研究  

Influence of buffers on the electrodeposition of nickel from a Watts bath

作　　者：高灿柱[1] 鹿玉理[1] 刘汝涛[1] 陈方[1] 李树本[2] 

机构地区：[1]山东大学环境工程系 [2]中国科学院兰州化学物理研究所

出　　处：《电化学》1998年第2期223-227,共5页Journal of Electrochemistry

摘　　要：缓冲剂对镀镍过程作用机理的研究①高灿柱鹿玉理刘汝涛陈方（山东大学环境工程系济南２５０１００）李树本（中国科学院兰州化学物理研究所兰州７３００００）电镀镍是量大面广的镀种，它作为镀铬、贵金属、仿金、枪黑、黑镍的底层，用途非常广泛［１］．在镀镍过程中，...The electrochemical reactions occurring during the deposition of nickel from Watts bath have been examined using the voltammetric technique. The important reactions taking place at the anode and cathode have been identified. The influence of buffers HAc,H_3BO_3 and NH_4Cl on the rate of nickel deposition was marked in the lower concentration (0.01-0.05 mol/L) of buffers. The reason why buffers make the rate of nickel deposition increase were discussed.

关 键 词：硼酸 氯化铵 醋酸 电镀镍 缓冲剂 镀镍 机理 

分 类 号：TQ153.12[化学工程—电化学工业]