引线框架可焊性电镀新技术  

New Solderability Electroplating Technology in Lead Frame

作　　者：曾旭[1] 卢桂萍[1] 杨杰[1] 贺岩峰[1,2] 

机构地区：[1]长春工业大学,吉林长春130012 [2]上海新阳半导体材料有限公司,上海201616

出　　处：《电子工艺技术》2009年第5期291-294,共4页Electronics Process Technology

摘　　要：尽管从总体上来说,Sn系合金和纯Sn无铅镀层的综合性能均不如Sn-Pb合金镀层,在实际应用中出现的问题较多,仍属于过渡生产阶段。但是随着人们对环境的日益重视,长期以来广泛应用于电子连接和封装中的Sn-Pb合金及其镀层正逐渐被这些无铅化电镀新技术所取代。另外,PPF引线框架电镀技术凭借其优良的焊接性能以及工艺优势,成为目前国内外正在积极开发和应用的新技术。系统地阐述了IC引线框架无铅化电镀技术方面的应用情况、存在问题及今后的发展趋势。Although the properties of Sn alloys and pure Sn lead -free platings are not as good as Sn - Pb alloy plating, and are still in the stage of transition production, there are many problems in the practical application. With are increasing emphasis on the environment, Sn - Pb alloy and plating which have widely used in the electronic connectivity and packaging for a long time are being gradually replaced by new lead- free plating technology. In addition, PPF leadframe plating technology, with its excellent welding performance and technology advantages, becomes a actively developing technology at home and abroad. The applications, existing problems and future trends of lead - free electroplating technology are systematically illustrated.

关 键 词：可焊性镀层 锡基合金 无铅纯锡 Pd—PPF Au—Ag合金镀 

分 类 号：TQ153[化学工程—电化学工业]