强流氧离子注入机装卸片控制系统  

Wafer Transport Control System of the High-current Oxygen Implanter

作　　者：罗宏洋[1] 汤辉[1] 龙娟[1] 

机构地区：[1]中国电子科技集团公司电子第四十八研究所,湖南410111

出　　处：《电子工业专用设备》2009年第9期38-40,共3页Equipment for Electronic Products Manufacturing

摘　　要：介绍了一种用于强流氧离子注入机的装卸片控制系统,控制系统采用多轴运动控制器实现了多个电机的协同运动,解决了晶圆在传送过程中的中心偏差校正和角度校正的问题,并最终实现了晶圆的全自动传送。A wafer transport control system of the high-current oxygen implanter is introduced. By using multaxis motion controllers in the control system, motion control of multiaxis motoried systems is realized, and sloved the problem of correcting the deviation of wafer center and the problem of adjusting gap angle, and fully automatic wafer transportting is finally realized.

关 键 词：离子注入机 微粒污染 全自动 装卸片 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]