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作 者:杨杰伟[1] 刘治华[1] 赵江铭[1] 吴一辉[2]
机构地区:[1]郑州大学机械工程学院,郑州450001 [2]中国科学院长春光学精密机械与物理研究所应用光学国家重点实验室,长春130033
出 处:《微纳电子技术》2009年第9期551-556,共6页Micronanoelectronic Technology
基 金:国家自然科学基金资助项目(60574089)
摘 要:为了在平面微电机有限大尺寸的定子上制作大深宽比结构的绕组线圈,对大深宽比微结构的制作工艺进行了研究,综合比较各方面因素,从中找出了成品率高、可重复性好、工艺步骤简单的平面线圈的制作工艺,即在Si沟槽里通过微电铸得到大深宽比平面铜线圈的深刻蚀成型电铸工艺;分析了光刻工艺关键参数之间的关系及对后续工艺的影响。通过该工艺制作的直径10mm定子线圈深宽比较大(宽40μm、深80μm),且无空洞。该工艺有很大的深宽比挖掘潜力,也可应用在其他需要较大深宽比平面线圈的微执行器的制作中。Many kinds of fabrication processes of microstructures were studied in order to fabricate a high-aspect-ratio coil on the stator with finite size of a planar micromotor. Compared a tot of aspects synthetically, a kind of fabrication process based on the deep etching-molding-electroplating technology was found. The technology is easy to produce perfect products and has a good reproducibility and a relatively simple procedure. In this case, the planar copper coil with highaspect-ratio was obtained by micro-electroplating the seed layer in the silicon trench. And the relationships of the key parameters in the photolithography processes and the effect on the following process were analyzed. The 10 mm diameter planar coil with a good high-aspect-ratio (40μm in width, 80μm in depth) without any voids was fabricated by this technology. Moreover, the technology has a good potential for higher aspect ratio and can be used in the fabrication of high-aspect-ratio planar coil in other microactuators
分 类 号:TM303.3[电气工程—电机] TN305.7[电子电信—物理电子学]
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