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机构地区:[1]桂林电子科技大学信息与通信学院,广西桂林541004
出 处:《电子科技》2009年第10期7-9,35,共4页Electronic Science and Technology
摘 要:在分析温度对集成电路芯片工作可靠性、安全性影响的基础上,利用与温度成正比的PTAT电流和负温度系数的PN结电压,设计了一种低功耗的过温保护电路。该电路结构简单、工艺兼容性好、具有良好的移植性,可以应用于音频功放及各类集成电路芯片中。同时该电路还具有温度的迟滞特性,可以更好地保护芯片,避免振荡的产生。0.35μm Cadence Specture仿真结果表明,该电路功耗低且可以实现高精度的过温保护功能。Based on the analysis of the effect of temperature on the reliability and the stability of integrated circuit chips, a low power consumption thermal protection circuit is designed using the PTAT (Proportional to Absolute Temperature)current and the voltage of PN-junction with a negative temperature coefficient. This circuit is characterized by simple structure, good process compatibility and good transplantability and therefore find wide applications in audio power amplifiers and various integrated circuit chips. It also has the function of temperature hysteresis which prevents the damage by thermal-oscillation and avoids oscillation. Cadence specture simulation with 0. 35 μm CMOS technology shows that the circuit has low power consumption and high precision of thermal-shutdown function.
分 类 号:TN43[电子电信—微电子学与固体电子学]
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