微电子封装用各向异性导电胶膜的研究进展  

The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging

作　　者：陈莹 余凤斌 田民波[2] 

机构地区：[1]山东天诺光电材料有限公司,济南250300 [2]清华大学材料科学与工程系,北京100084

出　　处：《绝缘材料》2009年第5期34-37,共4页Insulating Materials

基　　金：火炬计划(2008GH031242);济南市科技攻关项目(065012)

摘　　要：综述了各向异性导电胶膜的结构、导电机理、性能指标及其研究进展,提出了各向异性导电胶膜存在的技术问题及发展方向,为进一步研究开发性价比更高的微电子互连用各向异性导电胶膜提供技术参考。With the development of microelectronic packaging technologies, anisotropic conductive adhesive films are widely used as one kind of lead-free interconnect materials in the electronic products. This paper introduced the construction, electrical conduction mechanism, performance index and the recent development of anisotropic conductive adhesive films, which can help develop new conductive adhesive films used as microelectronic interconnection materials with excellent performance price ratio.

关 键 词：各向异性导电胶膜 电子封装 性能 研究进展 

分 类 号：TM24[一般工业技术—材料科学与工程]