MCM基板钎焊设备  

MCM Substrate Brazing Equipment

作　　者：周社柱[1] 王永卿[1] 杨晓东[1] 杨永虎[2] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024 [2]装备指挥技术学院,北京102249

出　　处：《科技情报开发与经济》2009年第31期125-127,共3页Sci-Tech Information Development & Economy

摘　　要：MCM技术的出现极大地推动了现代微电子技术的发展,集成电路正朝着大规模、高密度、多功能、小尺寸的方向发展。MCM基板作为MCM的最基础也是最重要的组成单元,直接决定了整个集成电路的电参数和功能特点。面对传统MCM基板生产设备的缺陷和产能的不足,开发了新型的真空钎焊设备,很好地解决了产能和空洞率的问题,使得生产效率和产品质量都有了极大的提高。着重介绍了MCM基板钎焊设备的结构特点和重要的性能参数。MCM technology has greatly promoted the development of modern micro-electronics.Integrated circuits are developing towards the direction of large-scale,high-density,multi-function and small-size.MCM substrate,being as the most basic and most important part of MEM,directly determines the electrical parameters and functional characteristics of the integrated circuits.For resolving the flaws and capacity lacks of traditional MCM substrate equipment,we have developed a new type of vacuum brazing equipment. The new vacuum brazing equipment has perfectly resolved the problems of lack of capacity and voidage of traditional equipment, improving production efficiency and product quality greatly. This paper mainly focuses on the structural characteristics and some important parameters of MCM substrate equipment.

关 键 词：钎焊设备 真空度 温度偏差 空洞率 

分 类 号：TN40[电子电信—微电子学与固体电子学]