服务于IC产业的MEMS探卡  

MEMS Probe Cards for IC Industry

作　　者：程融[1] 蒋珂玮[1] 汪飞[1] 李昕欣[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术国家重点实验室,上海200050

出　　处：《微纳电子技术》2009年第12期705-714,共10页Micronanoelectronic Technology

基　　金：国家重点基础研究发展计划(973计划)资助项目(2006CB300405);国家自然科学基金资助项目(60725414;60721004)

摘　　要：圆片级芯片测试在IC制造工艺中已经成为不可或缺的一部分,发挥着重要的作用,而测试探卡在圆片级芯片测试过程中起着关键的信号通路的作用。分析指出由于芯片管脚密度的不断增加以及在高频电路中应用的需要,传统的组装式探卡将不能适应未来的测试要求;和传统探卡的组装方法相比,MEMS技术显然更适应当今的IC技术。综述了针对MEMS探卡不同的应用前景所提出的多种技术方案,特别介绍了传感技术国家重点实验室为满足IC圆片级测试的要求,针对管脚线排布型待测器件的新型过孔互连式悬臂梁芯片和针对管脚面排布型待测器件的Ni探针阵列结构的设计和制造。The wafer-level testing plays an indispensable role and becomes an important step in the IC fabrication process. The probe card is used as the interface for signal routing during the wafer-level IC testing. The conventional manually assembled probe cards, however, will not be suitable for the next generation IC testing for the increasing pad density and the high frequency circuits. Compared with the conventional assembly techniques, MEMS is more compatible with present IC technology. Several schemes of State Key Laboratory of Transducer Technology are reviewed. A novel cantilever type probe card with through wafer interconnects for the dies under test （DUT） with line-on-center arrayed pads and a densely arrayed Ni microprobe for the DUT with area arrayed pads are introduced. The design and fabrication of the two MEMS probe cards can meet the technical requirement of IC wafer-level testing.

关 键 词：圆片级测试 芯片测试探卡 微机械电子系统 过孔互连 镍探针阵列 

分 类 号：TP216[自动化与计算机技术—检测技术与自动化装置]