镍离子注入Al_2O_3陶瓷表面化学镀铜层与基体结合特征  

Characteristics of Bonding between Copper Coating Electroless Plated on Ni Ion Implantated Al_2O_3 Ceramic Surface and Substrate

作　　者：王晓虹[1] 朱媛媛[1] 孙智[1] 

机构地区：[1]中国矿业大学材料科学与工程学院,江苏徐州221116

出　　处：《电镀与精饰》2010年第2期1-3,26,共4页Plating & Finishing

基　　金：江苏省自然科学基金资助项目(DK2004032);中国矿业大学青年科研基金资助项目(2008A046)

摘　　要：用金属蒸汽真空弧离子源在Al2O3陶瓷表面注入Ni2+离子,然后进行化学镀铜。用扫描电镜分析了离子注入辅助Al2O3陶瓷表面化学镀Cu镀层和基体的结合行为。结果表明:镀层呈层状结构生长,镀层与基体存在紧密结合、疏松结合和微孔结合三种形式,紧密结合区镀层像锯齿一样"嵌入"陶瓷基体。镀层与基体的结合机理为机械结合和冶金结合共同作用。The Al2O3 ceramic was implanted with nickel ion using a metal vapour vacuum arc （MEVVA） ion source. And then a thin copper film was made on surface of the ceramic by copper electroless plating. The characteristics and microstructure of the bonding were studied by scanning electronic microscope （SEM）. The results show that the copper film grows layer-by-layer and finally forms a laminated structure. There are three kinds of bonding modes between plating layer and Al2O3 ceramic, which are close bonding, loose bonding and micropore bonding, respectively. By close bonding, the plating layer is embedded in the Al2O3 ceramic. The bonding mechanism of plating layer with Al2O3 ceramic has the characters of both the mechanical bonding and electrochemical metallurgy bonding.

关 键 词：离子注入 化学镀铜 AL2O3 微观组织 界面结合 镍离子 

分 类 号：TG174.444[金属学及工艺—金属表面处理]