电解转印法加工凹坑阵列结构试验研究  

Experiment Study on Machining Array Micro-pits in Electrochemical Machining Method with a Mask onto the Cathode

作　　者：杜海涛[1] 曲宁松[1,2] 李寒松[1,2] 钱双庆[1] 

机构地区：[1]南京航空航天大学机电工程学院,南京210016 [2]南京航空航天大学江苏省精密与微细制造技术重点实验室,南京210016

出　　处：《机械工程学报》2010年第3期172-178,共7页Journal of Mechanical Engineering

基　　金：国家自然科学基金(50875129);江苏省自然科学基金(BK2007530);国家高技术研究发展计划(863计划;2006AA04Z321)资助项目

摘　　要：为得到降低摩擦副表面磨损所需的微小凹坑阵列结构,提出电解转印法加工凹坑阵列的工艺方法。对电解转印法加工过程进行有限元仿真,分析光刻胶膜厚度对凹坑尺寸和形状的影响。用光刻的方法制作尺寸均一,单个孔径为100μm的阴极平板。进行微细电解加工试验,试验分析脉冲电源频率和脉冲占空比对加工结果的影响。结果表明,采用电解转印法加工微小凹坑阵列结构,可以获得平均直径为200μm,深度10μm的凹坑阵列。To obtain micro-pits array which can reduce friction and wear of friction pairs, an electrochemical machining method with a mask onto the cathode is proposed to produce the micro-pit array patterns. Finite element simulation of the method is carried out to analyze the effect of the photoresist thickness on the pit size and shape. The experiments of micro-ECM are done to analyze the effect of frequency and duty cycle on the diameter of micro-pits, in which the cathode plate with the hole diameter of 100 μm is produced by using lithography method. The experimenter’s result reveals that the micro-pits with the diameter of 200 μm and the depth of 10 μm can be obtained in electrochemical machining method with a mask onto the cathode.

关 键 词：光刻 微细电解加工 凹坑阵列 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]