LED封装的热控制优化设计  

Optimization of Thermal Management for High Power LED

作　　者：刘波[1] 洪峰[1] 李秋俊[1] 冯世娟[1] 

机构地区：[1]重庆邮电大学光电工程学院,重庆400065

出　　处：《半导体光电》2010年第1期34-37,共4页Semiconductor Optoelectronics

基　　金：重庆市科技攻关项目(CSTC2005AB4016)

摘　　要：基于某型LED模块的实验结果,从热膨胀匹配、冷却技术的选择、发光效率、焊料及硅胶选择等方面对大功率LED的热控制问题进行了优化设计。实验结果表明,优化设计后的大功率LED的转换效率和光通量等指标都有了一定程度的改善。Based on the experimental results of a LED module, in terms of the thermal expansion match, the choice of cooling technology, luminous efficiency and the choice of solder and silicagel, an optimal design of thermal management problem is proposed for high--power LEDs. Experimental results of the optimum design show that the conversion efficiency, luminous flux and other indicators of high power LEDs obtain a certain degree of improvement.

关 键 词：LED 可靠性 热沉材料 热控制方法 

分 类 号：TN305.94[电子电信—物理电子学]