微电子组装焊点可靠性的研究现状  

Research status of soldered joint reliability in electronic package

作　　者：盛重[1] 薛松柏[1] 张亮 皋利利[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,210016

出　　处：《焊接》2010年第2期7-13,共7页Welding & Joining

基　　金：2008年南京航空航天大学大学生创新基金资助项目;江苏省普通高校研究生科技创新计划资助项目;2006年江苏省"六大人才高峰"资助项目

摘　　要：随着微电子技术的发展,组装密度的不断提高,一个焊点的破坏往往导致整个封装结构的失效,因此,焊点的可靠性越来越受到人们的重视。综合介绍了无铅化焊接由于钎料的差异与工艺参数的调整给焊点可靠性带来的相关问题,此外,对焊点的失效机理进行了分析,并进一步讨论了影响焊点可靠性的因素及解决方案。The failure of one soldered joint is frequently found to be the origin of the failure of the whole package with the development of microelectronies and the improvement of the assembly density.Therefore,it is necessary to pay more attention to the reliability of soldered joint. The related problems in reliability of soldered joint were brought due to the difference of solder and adjustment of process parameters in leadfree soldering.In addition,the failure mechanism of soldered joint was analyzed.Besides,the influencing factors and solution scheme of reliability in soldered joint were further discussed.

关 键 词：焊点 焊接工艺 失效机理 可靠性 

分 类 号：TG115.28[金属学及工艺—物理冶金]