PCB镀通孔发生“空洞”的根本原因和对策  

The Basic and Countermeasure of the Plated Through Hole Voiding in PCB

作　　者：林金堵 吴梅珠 

出　　处：《印制电路信息》2010年第4期31-36,共6页Printed Circuit Information

摘　　要：文章概述了多层板镀通孔发生"空洞"的根本原因与对策。基材、钻孔、孔壁粗糙度、孔尺寸、化学镀铜和电镀铜等都会影响PTH的"空洞"问题。The paper describes the basic and countermeasure of the plated through hole voiding in PCB. The substrate material, drilling hole, hole-wall topography, hole size, electroless copper, and plated copper can significantly impact the hole-wall voids, adhesion, and reliability of the PTH.

关 键 词：镀通孔 镀层“空洞” 镀层附着力 高性能基材 孔壁表面状态 化学镀铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]