基于MCM-D工艺的3D-MCM工艺技术研究  

Study on 3-Dimensional Multi-Chip Module Technology Based on MCM-D Technique

作　　者：刘欣[1] 谢廷明[1] 罗驰[1] 刘建华[1] 唐哲[1] 

机构地区：[1]中国电子科技集团第二十四研究所,重庆400060

出　　处：《微电子学》2010年第2期291-294,299,共5页Microelectronics

摘　　要：基于MCM-D薄膜工艺,开展了3D-MCM相关的无源元件内埋置、芯片减薄、芯片叠层组装、低弧度金丝键合、芯片凸点,以及板级叠层互连装配等工艺技术研究。通过埋置型基板、叠层芯片组装、板级叠层互连,实现了3D-MCM结构,制作出薄膜3D-MCM样品;探索出主要的工艺流程及关键工序控制方法,实现了薄膜3D-MCM封装。3D-MCM technology based on MCM-D thin film technique was studied, including embedded passive components, chip thinning, stacked die package, low-profile gold wire bonding, chip hump and board-level stacked structure intercormection assembly. The stacked structure of 3D-MCM was obtained by using techniques such as embedded substrate, stacked die package and board-level stacked structure intercormection. 3D-MCM samples were prepared. Main process and control methods for key steps were developed. And finally, 3D-MCM packaging was implemented.

关 键 词：3D-MCM 内埋置基板 叠层型结构 三维叠层互连 

分 类 号：TN451[电子电信—微电子学与固体电子学]