系统级封装（SIP）的优势以及在射频领域的应用  

Advantages of SIP Technology and Its application in RF Domain

作　　者：杨邦朝[1,2] 顾勇[1] 马嵩[1] 胡永达[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室 [2]电子科学技术研究院,成都610054

出　　处：《混合微电子技术》2010年第1期55-62,共8页Hybrid Microelectronics Technology

摘　　要：SIP（Systemin Package），指系统级封装。它强调的是将一个尽可能完整的电子系统或子系统高密度地集成于一个封装体内。它与系统芯片（SOC）互补，实现一种新的更高层次的混合集成，具有设计灵活、相对成本低、周期短等优势，其优势使之更加适合于未来电子整机系统。文中分析了RFSIP在无源元件集成、高密度互连、微磁电结构和可靠性等方面的关键技术，介绍了SIP技术在射频领域的典型应用实例。system in package （SIP） emphasizes that it integrates an entire electronic system or subsystem into a package. It uses mature sealing process to integrate many kinds of primary devices with system on chip （ SOC ） supplementary to achieve a new higher level of the hybrid integration. SIP future design flexible, low cost and short cycle, which makes it more suitable for the future complete electronic system. SIP has been well applied in RF domain and several pivotal RF SIP technologies such as integrated passive components, high - density interconnection, micro - magnetic structure and the reliability and so on which were introduced in this paper.

关 键 词：系统级封装 技术优势 混合集成 射频系统 

分 类 号：TN4[电子电信—微电子学与固体电子学] TN014