晶片键合技术及其在微电子学中的应用  

Wafer Bonding Technology and Its Applications in Microelectronics

作　　者：吴东平[1] 黄宜平[1] 竺士炀[1] 

机构地区：[1]复旦大学电子工程系

出　　处：《微电子学》1999年第1期44-49,共6页Microelectronics

摘　　要：论述了晶片键合技术的发展概况、基本原理和基本方法，并对键合晶片的表征技术作了介绍。最后着重介绍了晶片键合技术在微电子学领域中的应用。Great progress has been made in wafer bonding technology for the last decade,and the applications of the technology has become widespread.In this paper,the principle of wafer bonding is described and different approaches of the technology are dealt with.Also,the characterization of wafer bonding is discussed.Furthermore,specific introduction is given to the applications of wafer bonding technology in microelectronics.

关 键 词：集成电路 硅片直接键合 SOI结构 三维器件 

分 类 号：TN403[电子电信—微电子学与固体电子学]