锡膏印刷机纠偏平台的运动学与误差分析  

Research on the kinetics and error analysis of solder paste printer correction table

作　　者：刘宏[1] 邝泳聪[1] 王文昌[1] 梁经伦[1] 张宪民[1] 

机构地区：[1]华南理工大学机械与汽车工程学院,广东广州510640

出　　处：《机械设计》2010年第5期49-53,共5页Journal of Machine Design

基　　金：国家杰出青年科学基金资助项目(50825504);广东省科技攻关重点资助项目(2008A010300002);粤港关键领域重点突破招标资助项目(东莞专项200816822)

摘　　要：在建立全自动锡膏印刷机纠偏平台3自由度并联机构的结构模型基础上,利用运动学反解计算,推导了平台的纠偏算法;在此基础上,分析平台关键装配尺寸对纠偏精度的影响;并根据定位精度要求,反求平台容许的装配误差。实践证明,研究结论有助于锡膏印刷机纠偏精度和机器调试效率的提高。Based on the structure model established on the 3 DOF parallel mechanism of full automatic paste printer correcting platform, by using inverse kinematics solution to calculate, the correction algorithm of the platform is deduced; then, the correcting accuracy affected by main assembly dimensions is analyzed; finally, the allowable assembly dimension tolerance of the platform is reverse solved according to the correcting precision requirement. It has been found that the correcting accuracy of paste printer and the efficiency of printer debugging are improved greatly under the guid- ance of this paper＇ s research conclusion.

关 键 词：锡膏印刷机 纠偏平台 纠偏算法 误差分析 

分 类 号：TN605[电子电信—电路与系统] TH122[机械工程—机械设计及理论]