Cu对Sn-Bi焊料压入蠕变性能及显微组织的影响  

Effects of Cu on Indentation Creep Property and Microstructure of Sn-Bi Solder

作　　者：胡丽[1] 曾明[1] 张业明[1] 刘新刚[1] 沈保罗[2] 

机构地区：[1]西华大学材料科学与工程学院 [2]四川大学材料科学与工程学院

出　　处：《特种铸造及有色合金》2010年第5期485-487,共3页Special Casting & Nonferrous Alloys

基　　金：四川省教育厅重点培育项目(07ZZ033)

摘　　要：以纯Sn、纯Bi、纯Cu制得Sn-Bi和Sn-Bi-Cu合金。通过压入蠕变试验得到两种合金的蠕变曲线,总结了压入蠕变随着载荷和温度的变化规律。利用X射线衍射和扫描电镜对合金的物相组成和蠕变前后的显微组织进行分析,研究了Cu元素对Sn-Bi合金压入蠕变性能及显微组织的影响。结果表明,添加Cu元素可提高Sn-Bi合金焊料的抗蠕变性能。蠕变前,Sn-Bi合金中析出相为独立存在的颗粒状Bi,加入Cu后有块状的Cu6Sn5和发亮的少量颗粒状Bi析出;蠕变后,Sn-Bi合金中析出的Bi相变得细小并弥散分布于基体中,添加Cu后的合金中由于发生再结晶,块状析出相边缘变得光滑且有小块状Cu6Sn5,但含Bi的析出相几乎没有了。Sn-Bi and Sn-Bi-Cu alloys were prepared by using pure Sn,Bi and Cu.Creep curves were mapped by indentation creep testing,and change of indentation creep with loading and temperature was described.Chemical composition of precipitated phase and microstructure before and after creep were analyzed by X-ray diffraction (XRD) and scanning electron microscope(SEM ) to understand effects of Cu on indentation creep behavior and microstructure of Sn-Bi alloy.The results reveal that creep resistance of Sn-Bi solder is improved with adding Cu.The precipitate in the Sn-Bi alloy is Bi while it is Cu6Sn5 and trace granular phase Bi in Sn-Bi-Cu alloy before creep.After creep,granular phase Bi is refined and dispersedly distributed in the matrix alloy,while block precipitates are converted into Cu6Sn5 particle with smooth edge and with the disappearance of Bi phase in Sn-Bi-Cu alloy as a result of occurrence of recrystallization,responsible for the improvement of creep resistance of the alloy.

关 键 词：无铅焊料 显微组织 压入蠕变性能 CU SN-BI合金 

分 类 号：TG425[金属学及工艺—焊接]