电子组装材料润湿性评价的润湿平衡测试法  

Electronic Assembly Materials Wettability Evaluation Wetting Balance Test Method

作　　者：史建卫 李阳贵 方醒 

机构地区：[1]日东电子科技(深圳)有限公司,广东深圳518103

出　　处：《电子工业专用设备》2010年第6期40-47,56,共9页Equipment for Electronic Products Manufacturing

摘　　要：电子组装材料的润湿性对于形成良好的焊点质量至关重要,实际生产中要求对组装材料进行润湿性评估。采用润湿平衡测试法对氮气保护下的焊料及焊膏润湿性进行了测试,并阐述了此方法的工作原理、测试过程、评估标准及适用范围,为电子组装材料技术性采购提供了一种评估润湿性的有效方法。The wettability of electronic assembly materials for the formation of good solder joint quali-ty is essential, and the assembly materials wettability evaluation is required in actual production. In this paper, the wettability of solder and solder paste under a nitrogen atmosphere were tested by wetting balance test method, and the working principle of this method, the testing process, evaluation criteria and the useage scope of materials were described, and which provide an effective way to assess the wettability for electronic assembly a technical procurement.

关 键 词：润湿平衡测试 焊料 焊膏 电子组装 

分 类 号：TG421[金属学及工艺—焊接]