Sn晶须的转向生长机制  

Turning mechanism for tin whisker growth

作　　者：郝虎[1] 史耀武[1] 夏志东[1] 雷永平[1] 郭福[1] 李晓延[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《材料科学与工艺》2010年第3期378-381,共4页Materials Science and Technology

基　　金："十一五"国家科技支撑重点项目(2006BAE03B02)

摘　　要：为深刻理解Sn晶须转向生长现象的本质并建立其生长机制,利用稀土相CeSn3与ErSn3易氧化的特性实现了Sn晶须的加速生长,采用扫描电镜观察了Sn晶须在快速生长过程中展现出的生长行为.实验结果表明,时效过程中在稀土相的表面生长出大量的Sn晶须,一些Sn晶须的生长方向发生连续改变,少数Sn晶须在转向生长的同时出现变截面生长现象.Sn晶须根部的受力不均是其产生转向生长的原因,而Sn原子的供给速率与Sn晶须生长速率的不协调是Sn晶须产生变截面生长的原因.The growth behavior of tin whiskers on the surface of the oxidized RE-Sn phase was investigated in order to fully understand the nature of whisker growth phenomenon and establish its growth mechanism.The results indicate that large amounts of tin whiskers are formed on the oxidized RE-phases during the storage,some of which change the growth direction continuously,in particular,the diameter of some tin whiskers can be also changed during the turning growth.The change of stress state around tin whisker root results in the growth direction change and the incoordination between the growth rate and the tin atoms supply results in the cross section change.

关 键 词：无铅钎料 稀土 SN晶须 转向生长 

分 类 号：TN601[电子电信—电路与系统]