系统级封装（SIP）技术的现状与发展  

Present Situation and Development of SIP Technology

作　　者：杨邦朝[1,2] 马嵩[1] 顾勇[1] 胡永达[1] 唐伟[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室 [2]电子科学技术研究院,四川成都610054

出　　处：《混合微电子技术》2010年第2期89-101,共13页Hybrid Microelectronics Technology

摘　　要：随着电子信息技术的发展和社会的需求，电子产品不断向小型化、轻量化、高性能、多功能和低成本的方向发展。在过去几十年里，HIC、MCM、SOC等技术在微电子领域内起到了重要作用。现在，SIP这种新型的封装技术由于其设计灵活、周期短、兼容性好、成本低等特点而脱颖而出。引起了国内外高度的重视。成为弥补MCM、SOC等技术不足的一种理想封装技术。本文通过对SIP、SOP、SOC、MCM技术进行对比分析，总结出SIP新型封装技术的优缺点及其应用领域和发展前景。with the development of electronic information technology and the needs of the community, people request the electronic products to the direction of development of the small size ,light weight,high performance,lowcost ,multi -purpose. In the past few decades, HIC ,MCM ,SOC and other technologies play an important roles in the fields of microelectronics. Now, be- cause of its design flexibility,short cycle,good compatibility,low cost, people pay more attention for SIPo SIP is a kind of ideal packaging technology, which absolutely make up the shortcoming of MCM,SOC and so on. Through the analysis.and comparison of SIP,SOP,SOC,MCM, this paper presents the prominent advantages of SIP technology and its development prospects.

关 键 词：系统级封装 关键技术 应用 发展前景 

分 类 号：TN305.94[电子电信—物理电子学]