基于LDI技术的微波印制电路板工艺  

Novel Process of Microwave PCBs Based on LDI Technology

作　　者：曾策[1] 高能武[1] 林玉敏[1] 

机构地区：[1]中国电子科技集团公司电子第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2010年第4期212-214,229,共4页Electronics Process Technology

摘　　要：针对传统微波印制电路制造中面临的对位和图形精度困难,分析了应用LDI(Laser Direct Imaging,激光直接成像)技术的技术优势。同时对LDI技术的关键特性进行了验证,表明LDI技术可提升微波印制电路产品技术水平、提升生产柔性并降低成本。In order to meet the requirements of advanced microwave printed circuit boards（PCB） for registration and imaging accuracy,the novel Laser Direct Imaging（LDI） technology is introduced ed.Some tests are carried out and shows that LDI can bring microwave PCBs to a higher technology stage.Farther more the flexibility of manufacture is improved and the cost is down.

关 键 词：LDI PCB 微波 

分 类 号：TN41[电子电信—微电子学与固体电子学]