采用过电铸工艺制造金属微细阵列网板  

Fabrication of metal micro hole array by using over-plating technology

作　　者：胡洋洋[1] 朱荻[1] 李寒松[1] 

机构地区：[1]南京航空航天大学江苏省精密与微细制造技术重点实验室,江苏南京210016

出　　处：《光学精密工程》2010年第8期1793-1800,共8页Optics and Precision Engineering

基　　金：国家863高技术研究发展计划资助项目(No.2009AA044205);国家自然科学基金重点资助项目(No.50635040);江苏省自然科学基金资助项目(No.BK2008043)

摘　　要：针对制作尺度<10μm的超小微细阵列网板非常困难的问题,提出了采用过电铸工艺制造超小尺寸微细阵列网板的方法。建立了过电铸工艺过程的电场模型,利用有限元分析技术对过电铸工艺过程进行模拟仿真。选取优化的工艺参数(烘胶120℃/60min,曝光3000mJ/cm2,显影2min等)利用光刻制作了高度为50μm、直径为50μm的AZEXP125nXT-10A光刻胶群柱结构,以此胶膜结构作为模具进行了过电铸工艺实验,并与仿真结果进行对比,结果证明了有限元仿真的正确性。最后,通过过电铸缩孔2h获得了厚度达70μm,孔径为4μm的微细阵列网板结构。实验表明,过电铸工艺是一种低廉、安全、可批量生产的制作超小阵列网板的方法。The over-plating technology was introduced to fabricate micro hole arrays, for it is difficult to fabricate a micro hole array with the size less than 10μm by traditional methods. A mathematical model was presented to simulate the over-plating process by Finite Element Method （FEM）. Using the optimized parameters （bake 120 ℃/60 min, exposure 3 000 mJ/cm2 , and development 2 min）,the AZ EXP 125nXT-10A resist structure in a diameter of 50μm and a height of 50μm was prepared, and then the over-plating technology was employed to shrink the micro hole. The experimental result shows that the simulation result is correct. Finally,a micro hole array in a diameter of 4μm and a height of 70μm was fabricated after over-plating 2h. The result indicates that over-plating is a simple and low cost method to fabricate micro hole array, and it is suitable for batch production.

关 键 词：光刻 AZ胶 金属微细阵列网板 过电铸 

分 类 号：TN305.7[电子电信—物理电子学] TG662[金属学及工艺—金属切削加工及机床]