基于FPGA的高速高密度PCB设计中的信号完整性分析  

Signal integrity analysis of high speed and high density PCB design based on FPGA

作　　者：韩刚[1] 耿征[1] 

机构地区：[1]中国科学院自动化研究所,北京100190

出　　处：《计算机应用》2010年第10期2853-2856,2860,共5页journal of Computer Applications

基　　金：国家863计划项目(2006AA01Z327;2007AA01Z338)

摘　　要：根据摩尔定律,高速高密度印刷电路板(PCB)的设计变得越来越复杂。针对大型或特大型高速高密度PCB设计中信号完整性的一些关键问题,如:PCB层叠、传输线类型、特征阻抗计算、互连拓扑结构、端接技术、延迟匹配、串扰分析、差分布线等,通过理论分析、仿真验证、工程实践相结合的方式进行讨论,并给出相应的解决方法或设计规则。在此基础上,给出现场可编程门阵列(FPGA)多层PCB板设计原则。具体工程实验证明,在这些规则或机制的驱动下,高速高密度PCB的设计能够获得良好的实际效果。According to the Moore＇s law, it becomes more and more complex to design high-speed and high-density Printed Circuit Board （PCB）. As to Signal Integrity （SI） of large or extra large high-speed and high-density PCB, a research method combing theory analysis and mode simulation with project practice was introduced; meanwhile, some solutions or design rules were put forward. Following issues were discussed： PCB stack-up, the styles of transmission line, characteristic impedance calculation, topology, terminations, delay matching, crosstalk, differential pair layout, etc. On this basis, a few of principles were given about multilayers PCB design based on Field Programmable Gate Array （ FPGA）. Specific project application proves that high-speed and high-density PCB design can get good practical resutts driven by these principles or mechanisms.

关 键 词：印刷电路板 信号完整性 阻抗控制 差分线 现场可编程门阵列 

分 类 号：TP331[自动化与计算机技术—计算机系统结构]