非光敏BCB工艺技术研究  

Study on Non-Photosensitive BCB Processing Technology

作　　者：刘欣[1] 谢廷明[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2010年第5期754-757,共4页Microelectronics

摘　　要：非光敏BCB介质具有介电常数小、吸水率低、热稳定性好、力学性能优良、固化温度低,以及表面平坦化特性好等优点,作为重要的介质材料,已经应用于薄膜多芯片组件(MCM)基板布线中。文章研究了薄膜多层布线工艺中非光敏BCB介质的涂覆、固化工艺,以及等离子刻蚀工艺;提出了优化的涂覆和固化工艺参数,使用适当的刻蚀掩膜以及优化后的刻蚀工艺参数,进行图形刻蚀,获得了厚度为4μm、表面粗糙度小于150 nm的表面平整的非光敏BCB介质膜,并在薄膜MCM多层布线基板中得到较好运用。Non-photosensitive benzocyclobutene（BCB） was developed for use as dielectrics in MCM due to its desirable properties,including low dielectric constant,low moisture absorptivity,high thermal stability,excellent mechanical behavior,low cure temperatures and planarized surface.Processing procedures,including coating,thermal curing and plasma etching associated with dry-etch BCB,were investigated.Optimized process parameters for coating and thermal curing were obtained.Pattern definition was made by using optimized parameters and proper etch mask.And a 4-μm-thick surface-planarized BCB film with roughness less than 150 nm was obtained,which was used in multi-layer routing substrates for thin-film MCM＇s.

关 键 词：多芯片组件 非光敏BCB 涂覆 固化 等离子刻蚀 

分 类 号：TN304[电子电信—物理电子学]