各向异性导电胶倒装封装电子标签的可靠性  

Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive

作　　者：陶军磊[1] 安兵[2,1] 蔡雄辉[2,1] 吴懿平[2,1] 

机构地区：[1]华中科技大学连接与电子封装中心,湖北武汉430074 [2]武汉光电国家实验室,湖北武汉430074

出　　处：《电子工艺技术》2010年第5期249-252,305,共5页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:60876070;60976076)

摘　　要：各向异性导电胶(ACA)广泛用于RFID电子标签芯片封装,具有芯片对位方便、热压温度低和工艺时间短的优点。但ACA互连本质上是机械接触,其互连可靠性强烈依赖于粘接界面性质、胶水粘接力及环境稳定性。本文试验表明,168 h高温高湿和D20 mm心轴弯曲对芯片粘接点的电接触性能有所影响;铜模组良品率显著高于铝天线Inlay。Anisotropic conductive adhesive（ACA） has been widely used in RFID chip packaging,and bears the advantages of convenient alignment,low processing temperature,and short processing time.Since ACA interconnection is essentially a mechanical contact,its interconnection reliability severely depends on the nature of the bonding interfaces,the adhesive bonding strength and the environmental stability.The experiments showed that,168 h high temperature and humidity test,and D20 mm mandrel bending test make some impact on the electric contact performance of the bonding point;the yield of the copper module significantly higher than that of the aluminum antenna inlay.

关 键 词：电子标签 各向异性导电胶 倒装封装 可靠性 

分 类 号：TN60[电子电信—电路与系统]