HDI多层印制电路板无铅再流焊爆板问题研究  

Study on Delamination of HDI Multilayer PCB in Lead-free Reflow Process

作　　者：邱华盛[1] 曾福林[1] 樊融融[1] 

机构地区：[1]中兴通讯,广东深训518057

出　　处：《电子工艺技术》2010年第5期261-266,共6页Electronics Process Technology

摘　　要：HDI多层印制电路板在无铅再流焊接中的爆板现象是严重威胁产品质量、导致生产线不能正常运转甚至停线的较严重的质量事件。重点分析了无铅再流焊接过程中最常见的爆板现象,讨论了爆板发生的机理,并在此基础上探讨了抑制爆板的技术措施。The delamination of HDI Multilayer PCB in the Lead-free reflow soldering is a serious quality accident which not only affects the quality of productions,but also leads to the interruption of production.The delamination phenomenon in the Lead-free reflow soldering process is analyzed firstly.Then the mechanism of the phenomenon is discussed.And the methods which avoid the delamination are studied.

关 键 词：HDI板 无铅再流焊接 爆板 

分 类 号：TN60[电子电信—电路与系统]