连续100W量子阱二极管激光器封装工艺  

Packaging technique of CW 100W quantum-well diode laser

作　　者：高松信[1] 雷军[1] 郭林辉[1] 吕文强[1] 武德勇[1] 唐淳[1] 

机构地区：[1]中国工程物理研究院应用电子学研究所,四川绵阳621900

出　　处：《强激光与粒子束》2010年第11期2510-2512,共3页High Power Laser and Particle Beams

基　　金：国家自然科学基金重大项目(60890201);中国工程物理研究院重点基金项目(2007A10001)

摘　　要：为了提高激光器输出功率,对研制的铜微通道冷却器性能进行了测试,分析了其散热能力。设计了一种在软焊料中掺杂金属添加剂的工艺,有效抑制了晶须生长,并利用该冷却器和新工艺封装出了连续100W大功率二极管激光器,并对封装的器件进行了性能测试。测试结果表明,封装的连续100W器件在工作电流105 A时,输出功率超过了100W,中心波长为808.5 nm,光谱半高宽为2.15 nm,器件的smile尺寸小于2μm,部分值小于0.5μm。In order to increase out power of DL,the copper micro-channel cooler＇s property was tested,and its ability to dissipate heat was analyzed.An indium alloy solder was developed,which can dispel crystal beard.The CW 100 W high power laser diode was packaged directly on the cooler with new technique and tested.The results of measurement show that the CW 100 W laser diode output power more than 100 W at drive current of 105 A,the central wavelengh is 808.5 nm and the FWHM is 2.15 nm.The smile effect of the packaged diode bars is usually less than 2 μm,for some samples,it is even less than 0.5 μm.

关 键 词：二极管激光器 封装 smile效应 微通道冷却器 焊料 

分 类 号：TN248.4[电子电信—物理电子学]