提高Al_2O_3陶瓷表面化学镀Cu层结合力的研究  

Improvement of Adhesion Between Electroless Cu Deposit and Ceramic Substrate

作　　者：李志勇[1] 穆道彬[1] 马莒生[1] 

机构地区：[1]清华大学材料科学与工程系

出　　处：《材料保护》1999年第7期8-10,共3页Materials Protection

摘　　要：化学镀Ｃｕ是Ａｌ２Ｏ３陶瓷基板表面金属化的一种颇具优势的方法，但镀层与基板之间的结合力较低影响其广泛应用。本文通过选取适当的腐蚀剂，改善了Ａｌ２Ｏ３陶瓷表面形貌，从而获得了２５ＭＰａ以上的镀层结合强度，可满足电子封装的要求。另外，本文通过ＳＥＭ及ＥＤＡＸ。AbstractElectroless copper plating was carried out on alumina substrate. The Al\-2O\-3 substrates were etched under different conditions to investigate the correlation between the adhesion strength and the surface morphology of Al\-2O\-3 Ceramic. It was confirmed that ceramic surface roughness and mechanical interlocking were two major causes promoting the adhesion. Molten NaOH etching, producing the combination roughening and interlocking, could reach the greatest copperto ceramic adhesion with more than 25 MPa.

关 键 词：化学镀 强度 电镀 三氧化二铝陶瓷 镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]