Sn-Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响  

Structure Transition of Lead-free Sn-Bi Solders and Its Effects on Solidification and Wettability

作　　者：李小蕴[1,2] 吴炜[3] 陈红圣[1] 祖方遒[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009 [2]合肥工业大学机械与汽车工程学院,安徽合肥230009 [3]合肥工业大学工业培训中心,安徽合肥230009

出　　处：《金属功能材料》2010年第6期36-39,共4页Metallic Functional Materials

摘　　要：本文通过电阻法研究了Sn-57%Bi无铅焊料在液相线以上一定温度范围内发生熔体结构转变的可能性及规律性,并以此为切入点研究了熔体结构转变前后Sn-57%Bi焊料的凝固组织和润湿性能的变化规律。结果表明：Sn-57%Bi无铅焊料在液相线以上785~900℃范围内发生了熔体结构转变,而且熔体结构转变细化了凝固组织,改变了微观形貌;经历熔体结构转变而凝固的合金焊料较未发生转变的合金铺展面积增大,润湿角减小。In this paper,the electrical resistivities of liquid Sn-57%Bi lead-free solder were measured.Based on the measured results of electrical resistivity,corresponding solidification and wettability experiments have been carried out.The results show melts structure transition was found out at 785~900 ℃ above the liquid line for lead-free Sn-57%Bi solder.Melts structure transition can refine primary phases and eutectic phases,and change micro-pattern.The wettabilities of the solder after structure transition is better than that of the solder before structure transition.

关 键 词：无铅焊料 SN-BI合金 熔体结构转变 电阻率 

分 类 号：TG425[金属学及工艺—焊接]