应对“后摩尔定律”的封装设备  

Packaging equipment:Response to the Challenge of "More-than-Moore"

作　　者：李燕玲[1] 于高洋[1] 童志义[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《电子工业专用设备》2010年第12期1-8,43,共9页Equipment for Electronic Products Manufacturing

摘　　要：介绍了在传统的摩尔定律发展速度受阻的形势下以及在封装技术的驱动下,特别是先进的TSV互连和3D堆叠三维封装技术创新的应用,"后摩尔定律"对半导体技术产业的发展产生了强大推动力。为了适应中段制程的来临,应对新兴封装技术的挑战,满足不同工艺阶段的封装需求,各封装工艺设备的性能也在不断地创新和提高,工艺被更多地物化在设备之中,涌现出了许多提供"总体解决方案"的封装工艺设备。最后对封装设备行业加强技术创新,实现跨越式发展提出了几点看法。A powerful driving force of More-than-Moore＇ s Law on the development of semiconductor technology industry driven in packaging technology, especially advanced 3D stacked-TSV interconnect and packaging technology innovation and application in the blocked situation of traditional Moore＇s Law development rate is described in this paper. In order to meet the coming of the middle-process and the challenges against emerging packaging technology, to meet the needs of different process stages of package, the package process equipment performance is continually innovated and improved. The pro- cess was solidified in the devices more and more, thus many offer of ＂turnkey solutions＂ package pro- cessing equipment emerged. Finally, a few comments about the packaging equipment industry to enhance technological innovation and the development by leaps and bounds is put forward.

关 键 词：后摩尔定律 封装技术 中段制程 3维硅通孔技术 封装设备 技术创新 

分 类 号：TN605[电子电信—电路与系统]