热循环条件下无铅焊点可靠性的有限元分析  

FEM Analysis of Effect of Thermal Cycling on the Reliability of Lead-free Soldered Joint

作　　者：吴卫华[1] 肖勇[1] 

机构地区：[1]三峡大学机械与材料学院,湖北宜昌443002

出　　处：《电子产品可靠性与环境试验》2010年第6期42-45,共4页Electronic Product Reliability and Environmental Testing

摘　　要：通过有限元数值模拟对Sn3.5Ag0.75Cu无铅焊料焊点的可靠性问题进行了分析。采用统一粘塑性Anand本构方程对焊料焊点结构进行有限元分析,研究焊点在热循环加载过程中的应力应变等力学行为。研究结果表明,在焊点内部焊点与基板结合处的应力较大,而焊点中央的应力较小;焊点在低温阶段的应力最大,在高温阶段应变最大;在升降温阶段的应力应变变化较大,而在保温阶段的应力应变变化较小。The finite element method is used to analyze the effect of thermal cycling on the reliability of Sn3.5Ag0.75Cu lead-free soldered joint.The mechanical performance of the solder joints is analyzed using visco-elastic-plastic constitutive Anand model and the distribution characteristics of the stress and strain in solder joints under thermal cycling loads are given.The results indicate that the maximum stress of the soldered joint concentrates in the interface between the soldered joint and the substrate.The maximum stress occurs at the low temperature stage.The maximum strain occurs at the high temperature stage.The stress-strain increase distinctly with temperature ramp up and down,but is stable at the invariable temperature stage.

关 键 词：热循环 无铅焊料 焊点 

分 类 号：TN05[电子电信—物理电子学]