声扫检测中易误判的塑封器件的验证方法  

PEM Validations Prone to Misjudgment in SAM Testing

作　　者：肖诗满[1] 彭泽亚[1] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2010年第6期46-48,共3页Electronic Product Reliability and Environmental Testing

摘　　要：塑封器件在高可靠性领域应用越来越广泛,为了降低使用风险,很有必要进行相应的检测或筛选,扫描声学显微镜检查就是其中一种很重要的无损检测手段。但是,在进行声扫时,对于某些最新的封装方式,需要特殊情况特殊分析,以避免因为器件的封装形式而非器件的缺陷拒收产品。在电子封装设计时,芯片表面可能涂覆一层有机材料来保护集成电路。但这种材料声扫结果往往与真正的分层一样显示为负波,容易误判为不合格。就这种结构及其声扫结果提出了几种验证方法。PEMs have been used more widely in the high reliability application.To mitigate the risk,some tests or screening are necessary,and SAM testing is an important non-destructive testing among them.For some new PEMs,some special treatments should be considered for specific circumstances during SAM to avoid improper rejections based on the package style instead of the defects of the devices.Some organic finishes used to protect the integrated circuits when packaged often have the same indication in the export image as that of actual delaminations,which is prone to misjudgments.Some validation techniques are presented for these package and its SAM results.

关 键 词：塑封器件 扫描声学显微镜检查 分层 

分 类 号：TG115.28[金属学及工艺—物理冶金]