直接键合硅片的亲水处理及其表征  

Characterization of Silicon Surface Hydrophilicity Treatment

作　　者：何进[1] 陈星弼[1] 杨传仁[1] 王新[1] 

机构地区：[1]电子科技大学微电子所,成都610054

出　　处：《半导体技术》1999年第5期23-25,29,共4页Semiconductor Technology

摘　　要：硅片直接键合（ＳＤＢ） 技术的关键在于硅片表面的亲水处理， 本文分析了亲水处理之微观机理。从界（表） 面物理化学角度讨论了接触角对硅片表面亲水性的表征及其准确测量方法，Successful Silicon to silicon direct bonding(SDB)mainly depend on the hydrophilicity treatment of silicon surface.Micro mechanism of hydrophilicity has been analyzed in the paper for the first time.From the point of physical chemistry of surface,the hydrophilicity level of common surface treatment can be characterized by the contact angle of a drop of water on the silicon surface.An indirect method to determine the contact angle based on suspensory principle is developed.

关 键 词：硅片直接键合 亲水处理 接触角 SDB技术 硅 

分 类 号：TN305.2[电子电信—物理电子学] TN304.12