SnAgCu无铅焊膏用溶剂的优化研究  

Research on the solvents optimization of SnAgCu lead-free solder paste

作　　者：薛静[1] 赵麦群[1] 范欢[1] 张金凤[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《电子元件与材料》2011年第2期36-38,共3页Electronic Components And Materials

基　　金：陕西省重点学科建设专项资金资助项目

摘　　要：以SnAgCu无铅焊膏铺展性能和焊点形貌作为评价的主要指标,通过回流焊接实验,对常用于焊膏的10种溶剂进行了单一溶剂优选,并对两种性能较好的溶剂进行复配优化研究。结果表明:A醇、二缩三乙二醇和B醚作为单一溶剂时焊膏的润湿性较好、焊点外形较饱满,铺展率都大于83%;A醇和B醚按质量比3:2复配时得到的焊膏铺展率达到93%以上,抗塌落性好,且焊点外观规则、光亮饱满、表面氧化物较少。The optimization of 10 solvents used in SnAgCu lead-free solder paste were carried out by reflow soldering with the spreadability and the spot morphology as the main comment indexes.And the properties of the composite solvents which was mixed by two solvents possessing good performances were studied.The results indicate that the pastes with A alcohol,B ether and triethylene glycol as single solvent have good wettability,plump spots,and the spreadabilities are all over 83%.When ζ（A alcohol：B ether） is 3：2,the solder paste has good anti-slumping ability and the spreadability is above 93%.The appearance of spots is regular,plump,beamy and less surface oxide.

关 键 词：无铅焊膏 有机溶剂 铺展率 回流焊 

分 类 号：TN604[电子电信—电路与系统]