氩离子注入PET表面沉积Cu膜的界面特性  

Adhesion between Cu film and PET substrate implanted with Ar ions

作　　者：滕旭[1] 张济忠[1] 冉杰[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084

出　　处：《黑龙江大学自然科学学报》2010年第6期723-726,共4页Journal of Natural Science of Heilongjiang University

基　　金：清华大学实验室开放基金资助项目

摘　　要：为了研究Ar离子注入对薄膜沉积的影响,使用2 keV的氩离子对PET进行表面注入,注入剂量为5×1011ions.cm-2,然后用离子溅射镀膜法,在PET表面均匀地沉积一层Cu膜,用台阶仪、俄歇探针、原子力显微镜等对其进行测试分析。结果表明,该合金膜的厚度为490 nm,膜表面平整,无缺陷。对该合金膜进行纳米划痕测试,得到临界载荷为8.5 mN。实验结果证明,Ar离子注入对薄膜性能有提高。PET was implanted with Ar ions with energy of 2 keV.The ion dose was 5×1011ions·cm-2.The PET was coated with Cu film.The Cu film was analyzed by nano hardness test,nano indentation test,Scanning Auger Nanoprobe,AFM etc.The Cu film was uniform deposited,and its thickness was 490 nm.The critical load exhibited during nano scratch test was 8.5 mN,the average of critical strength exhibited during the nano indentation test was 3.2 GPa.

关 键 词：PET 氩离子 溅射镀膜 CU膜 结合力 

分 类 号：TB43[一般工业技术]